Shin-Etsu KE1861 A/B two-component RTV potting compound for electrical and electronic components gray
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Detailed product description
Product Introduction
Shin-Etsu KE1861 A/B is a two-component silicone adhesive potting glue. It is a silicone potting glue with good fluidity for general industrial applications.
Shin-Etsu KE1861 A/B is a thermally conductive silicone potting compound. The hardness after curing is Shore A: 75, with good wear resistance and environmental resistance, acid and alkali corrosion resistance, and good shock absorption.
Product Application
Shin-Etsu KE1861 A/B is widely used in electrical insulation and has a wide applicable temperature range. Requirements for bonding, sealing and fixing of various electronic components and mechanisms; products with more such requirements. It has high and low temperature resistance, anti-aging, shock absorption and buffering, easy maintenance and excellent sealing and moisture-proof properties. Such as: electrical appliances, solar cells, batteries, hybrid integrated circuits, TC fans and components, electronic products, power, sensors, fluorescent lamps, membrane switches, LED display panels, electronic equipment, aviation systems, liquid crystal displays, cathode ray tubes, etc.
Shin-Etsu KE1861 A/B performance introduction
1. The same characteristics as one-component RTV: electrical characteristics, heat and cold resistance, vibration resistance, weather resistance, curing type, etc.
2. Layer curability: Deep curing can be performed on the surface and inside at the same time, regardless of the thickness of the rubber.
3. Curing speed adjustability: The curing speed can be adjusted by changing the type or amount of curing agent. or heat.
4. Storage: The base compound and curing agent are stored separately, so the product will not change during storage It will not become unusable due to curing. Two-component RTV rubber can be stored for a long time.
Product Specifications
| < span style="font-size: 14px;">Manufacturer | ShinEtsu |
| Product model # | KE-1861A/B |
| Curing method | Thermal curing |
| Single component/double Component | Two-component |
|
Color appearance | Gray |
| Density specific gravity@23°C | 2.22 g/cm3 |
|
Viscosity< /td> |
50 Pa·s |
| Mixing ratio | 100 : 100 |
| Cure conditions | 1hr @ 120C |
| Working hours | 5 Hours |
| Shore hardness |
Shore A 75< /td> |
| Tensile strength | 6.4 MPa |
|
Elongation td > |
80%@ broken |
| Shear strength | 1.00 MPa |
| Volume resistivity | 10 TΩ·m |
< td style="width: 47.7077%; height: 22px;">Dielectric strength | 25 kV/mm |
| Dielectric constant | 4.5 @ 50Hz |
| Dielectric loss factor | 2x10-3 @ 50Hz |
| Thermal conductivity | 0.83 W/m·K
|
| Available temperature range | < span style="font-size: 14px;">-40 to +180°C |