Provide primary & backup adhesive recommendations based on substrates, stress profile, takt time, with TDS comparison.

Define adhesive bead position, bonding surface geometry, overflow trenches, support ribs, and venting channels.

Parameterize dispensing speed / pressure / volume, wet-out time, and UV energy curve to create a stable process window.

Design curing station layout, UV lamp path & access, clamping/locating jigs, and assembly positioning strategy.

Ensure early-phase bonding design scales to automation, avoiding 'works manually but fails in mass-production' risks.

Support small-batch dispensing & curing trials, parameter tuning, reference samples, and build baseline controls.