Loctite M-21HP Medical Grade Two-Component Epoxy Light Yellow [Free Design Plan]-Materiomart
Loctite M-21HP Medical Grade Two-Component Epoxy Light Yellow [Free Design Plan]-Materiomart

Loctite M-21HP Medical Grade Two-Component Epoxy Light Yellow [Free Design Plan]

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LOCTITE® EA M-21HP™ Epoxy Adhesive - Assembtek

Two-Component Epoxy Adhesive · Room Temperature Curing · Beige Bonding Layer · High Peel Strength · Excellent Chemical Resistance · Good Electrical Insulation · Meets ISO 10993 Biocompatibility Standards. Suitable for disposable medical device assembly and multi-substrate precision bonding, adaptable to automated mass production, balancing strength and compliance.

Module 1: The Hero Specs

Core Features

Process Value

Two-Component Epoxy System

The resin and curing agent can be used after mixing in proportion, curing at room temperature without additional heating, adapting to various production rhythms, greatly reducing production energy consumption, and balancing bonding strength and production efficiency.

High Peel & Shear Strength

A tough beige bonding layer is formed after curing, with excellent peel resistance and shear strength, which can withstand a certain mechanical stress, adapt to the bonding needs of structural parts, and reduce product rework rate.

Medical-Grade Biocompatibility

Tested and qualified in accordance with ISO 10993 biocompatibility standards, with no harmful residues, it can be directly used for the assembly of disposable medical devices, meeting the strict compliance requirements of the medical industry.

Excellent Chemical & Electrical Insulation

After curing, it is resistant to erosion by various chemicals and solvents, and has good electrical insulation performance, adapting to insulation bonding scenarios in electronics, medical and other industries, and expanding the application scope.

Assembtek Process Summary: LOCTITE® EA M-21HP™ is a two-component epoxy adhesive that balances strength, compliance and process adaptability. Its room-temperature curing feature is suitable for automated mass production, with strong multi-substrate compatibility. It is especially suitable for the assembly of disposable medical devices, and is a cost-effective bonding solution in the medical and precision manufacturing fields.

Module 2: Technical Data & Performance Curves

Typical Properties of Uncured Material

Parameter

Typical Value

Test Standard/Description

Technology Type

Epoxy Adhesive

Two-component (resin + curing agent), dedicated for bonding

Mixing Ratio (Weight)

Resin:Curing Agent = 100:55

Mix strictly in proportion to ensure curing effect

Mixing Ratio (Volume)

Resin:Curing Agent = 2:1

Compatible with conventional metering equipment, easy for mass production operation

Viscosity (25℃)

Medium Viscosity

Resin: 40000-90000 cP, Curing Agent: 5500-8000 cP (LMS Standard)

Working Time (25℃)

20 Minutes

Control the amount of single mixing for batch assembly to avoid waste

Gel Time (22℃)

10-25 Minutes (LMS Standard)

Increased ambient temperature will shorten the gel time, adapting to rapid curing needs

Typical Properties of Cured Material (Cured at 25℃)

Parameter

Typical Value

Test Standard

Tensile Strength

39 N/mm² (5700 psi)

ISO 527-2

Shear Strength (Aluminum, Etched & Polished)

28.2 N/mm² (4090 psi)

ISO 4587

Glass Transition Temperature (Tg)

60℃

ASTM E 228

Shore Hardness (D)

74-84 (LMS Standard)

ISO 868

Selection Insight: The medium viscosity of this product is suitable for 0.1-0.2mm gap filling, and the 20-minute working time is suitable for efficient batch assembly; the 60℃ glass transition temperature is suitable for conventional working conditions. It has excellent shear strength on aluminum substrates and meets medical-grade certification, so it is preferred for disposable medical devices and precision metal/glass bonding scenarios.

Module 3: Applications & Substrates

Typical Application Scenarios

Industry/Component

Specific Scenarios

Medical Devices

Assembly of disposable medical devices, such as medical catheters, small medical consumables, and medical component bonding, meeting ISO 10993 biocompatibility requirements

Precision Manufacturing

Metal and glass bonding, electronic component positioning, precision structural part bonding, adapting to the needs of the electronics industry relying on excellent electrical insulation

General Industry

Bonding of engineering plastics (PC, ABS, etc.), wood and ceramic bonding, sealing of small structural parts, chemical resistance adapting to complex working conditions

Substrate Compatibility Recommendation

Substrate Type

Compatibility

Usage Instructions

Glass

Excellent

The shear strength reaches 32.3 N/mm², the surface must be cleaned before bonding, suitable for bonding precision glass components

Metals (Aluminum, Steel, Stainless Steel)

Excellent

Aluminum (etched and polished) has the best shear strength; steel substrates need sandblasting treatment to improve bonding stability

Rigid Plastics (PC, ABS, PVC)

Good

Compatible with engineering plastics such as PC and ABS; the shear strength of PVC reaches 7.9 N/mm², and surface oil stains must be removed

Wood, Ceramics

Good

The shear strength of Chinese fir bonding reaches 11.4 N/mm², suitable for bonding small ceramic and wood components, ensuring the substrate is dry

Module 4: Process Engineering Insight

Mass Production Optimization & Cost Reduction Tips

💰 Cost Reduction Tip 1: Precisely Control Mixing Ratio to Reduce Rework Waste

The weight mixing ratio of this product is 100:55 (resin:curing agent), and the volume ratio is 2:1. Manual mixing is prone to ratio deviation, leading to incomplete curing and bonding failure. It is recommended to use two-component dedicated mixing guns and static mixing nozzles to precisely control the ratio, which can reduce rework loss and material waste by about 15%.

💰 Cost Reduction Tip 2: Optimize Working Time to Improve Mass Production Efficiency

The working time of the product is only 20 minutes at 25℃, and high temperature will further shorten it. During mass production, the "small-batch mixing and rapid assembly" mode can be adopted, and the mixing amount per batch is controlled to the amount that can be completed within 20 minutes; the ambient temperature is controlled at 20-22℃, which can extend the working time, reduce operation error tolerance, and reduce material scrapping.

⚙️ Mass Production Process Tips

         Substrate Pretreatment: Before bonding, it is necessary to remove paint, oxide layers, oil stains, release agents and other impurities on the substrate surface; metal substrates are recommended to be etched/sandblasted, and plastic substrates are slightly polished, which can increase the bonding strength by more than 30%.

         Glue Application Control: Use automated dispensing equipment to control the glue application thickness at 0.1-0.2mm (optimal bonding thickness), avoiding material waste and appearance defects caused by excessive glue application, and ensuring shear strength.

         Curing Optimization: Conventional curing is 24 hours at room temperature (25℃); if rapid mass production is needed, 65℃ curing for 2 hours or 93℃ accelerated curing can be adopted, which greatly shortens the production cycle without affecting the bonding performance.

         Cleaning and Tool Reuse: Uncured adhesive can be cleaned with ketone solvents; excess cured adhesive layer can be removed by mechanical grinding; mixing tools can be reused after cleaning, reducing consumable costs.

Module 5: Compliance & Quality

         Biocompatibility Certification: Tested and qualified in accordance with ISO 10993 biocompatibility standards (Henkel Test Protocol), it can be used for the assembly of disposable medical devices, with no harmful residues, meeting the compliance requirements of the medical industry.

         Material Standard: Complies with Loctite Material Standard (LMS, version June 5, 2000). Each batch of products is provided with a Certificate of Analysis (COA), which is traceable to ensure product performance consistency.

         Sterilization Tolerance: After sterilization by ethylene oxide (EtO) and gamma rays (25-50 kGy), the bonding strength remains good; it can withstand one steam autoclave sterilization, and more than 3 times of sterilization needs to be tested and verified in advance.

         Usage Restrictions: Prohibited for use in pure oxygen or oxygen-enriched systems, and shall not be used as a sealant for chlorine or other strong oxidants; not recommended for bonding scenarios that are long-term immersed in strong acid or strong alkali environments.

         Environmental and Safety Compliance: The solvent volatilization of the product meets the environmental protection standards for industrial adhesives, with no excessive harmful volatile substances; construction and storage must strictly follow the SDS safe operation specifications, wear gloves, and avoid skin contact.

Module 6: Expert FAQ

Q1: Must the mixing ratio of LOCTITE® EA M-21HP™ be strictly followed? What are the effects of deviation?

A: The ratio of resin:curing agent = 100:55 (weight) and 2:1 (volume) must be strictly followed. Ratio deviation will lead to incomplete curing, significant reduction in bonding layer strength, easy cracking, and even failure to cure, resulting in product scrapping. It is recommended to use dedicated mixing equipment during mass production.

Q2: Can the product withstand high temperature after curing? What is the long-term service temperature range?

A: The glass transition temperature after curing is 60℃, the recommended long-term service temperature is not more than 50℃, and it can withstand high temperature of 87℃ for a short time; after exceeding 60℃, the bonding strength will gradually decrease, and aging test is required in advance for high temperature working conditions.

Q3: Is a primer needed when bonding different substrates?

A: Most substrates (metal, glass, PC, ABS, etc.) do not require a primer and can be directly bonded after cleaning and pretreatment; if bonding low surface energy plastics (such as PE/PP), it is recommended to use a primer to improve bonding strength.

Q4: How to store the unmixed resin and curing agent? What is the shelf life?

A: Unopened products should be sealed and stored in a dry environment at 8-21℃. Storage below 8℃ or above 28℃ is prohibited, otherwise it will affect product performance; the shelf life under optimal storage conditions is 12 months, and it is recommended to use it as soon as possible after opening, and do not pour it back into the original container.

Q5: What is the chemical resistance of this product? Can it be used in scenarios contacting solvents?

A: It has excellent chemical resistance. After contacting 10W30 engine oil, unleaded gasoline, 50/50 water-ethylene glycol solution, etc., the strength retention rate can reach more than 80%; short-term contact with acetone and isopropanol has no obvious damage, and long-term contact needs to be tested in advance.

Module 7: Resources & CTA

Get detailed technical data to optimize your production process:

📄 [Download LOCTITE® EA M-21HP™ TDS Technical Data Sheet]

Obtain complete performance parameters, curing curves, detailed substrate compatibility data and construction parameter guidance to assist in process design and optimization.

🧪 [Download Complete SDS/MSDS Safety Data Package]

View key safety information such as flash point, chemical stability, safe operation specifications, and waste liquid treatment methods to ensure safe and compliant construction.

👉 [Button: Consult Application Engineer] Our laboratory can provide free substrate bonding testing, mixing ratio optimization and post-sterilization strength verification services to help you solve precision bonding pain points, improve mass production efficiency and reduce costs.

📞 Contact Us: The professional technical team of Assembtek.com provides you with one-on-one process solutions to adapt to your mass production needs.

  • Adhesive
  • Chemical Resistant
  • epoxy resin
  • glass
  • high shear strength
  • ISO10993
  • metal
  • moisture proof
  • room temperature cure
  • waterproof
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