LOCTITE® 5055 Silicone Adhesive - Assembtek
One-Component Silicone Adhesive · UV/Visible Light Curing · Light Yellow Transparent Liquid · Low Viscosity & High Toughness · Excellent Electrical Insulation · Good Gas Permeability · Meets ISO 10993 Biocompatibility Standards. Suitable for disposable medical device assembly, it can realize multi-scenario applications such as bonding, potting, coating and sealing, adapt to automated mass production, and balance process flexibility and compliance.
Module 1: The Hero Specs
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Core Features
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Process Value
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One-Component Silicone System
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No mixing required, ready to use out of the box, greatly simplifying the operation process, reducing manual mixing errors, improving mass production efficiency, and lowering labor costs and material waste.
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UV/Visible Light Dual Curing
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Relying on UV/visible light for rapid curing, the surface curing speed is fast, which can adapt to automated UV curing production lines, greatly shortening the production cycle and improving batch assembly efficiency.
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Medical-Grade Biocompatibility
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Tested and qualified in accordance with ISO 10993 biocompatibility standards (Henkel Test Protocol), with no harmful residues, it can be directly used for the assembly of disposable medical devices, meeting the strict compliance requirements of the medical industry.
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Low Viscosity, High Toughness & Multi-Scenario Adaptability
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The low viscosity feature facilitates potting and coating operations; after curing, it forms a tough and transparent silicone rubber, which has both bonding and sealing functions, and is suitable for precision assembly needs in medical, electronic and other industries.
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Assembtek Process Summary: LOCTITE® 5055 is a one-component UV-curable silicone adhesive specially designed for the assembly of disposable medical devices. It requires no mixing, cures quickly, has low viscosity suitable for multi-process operations, and combines biocompatibility and electrical insulation. It is an efficient and compliant multi-scenario bonding and sealing solution in the field of medical precision assembly.
Module 2: Technical Data & Performance Curves
Typical Properties of Uncured Material
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Parameter
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Typical Value
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Test Standard/Description (LMS Standard)
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Technology Type
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Silicone Adhesive
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One-component, alkoxy silicone, suitable for bonding, potting, coating and sealing
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Appearance
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Light Yellow Transparent Liquid
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Facilitates automated visual inspection to observe the uniformity of glue application
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Specific Gravity (25℃)
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0.98
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Uniform texture, easy for precise measurement and glue application
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Viscosity (25℃)
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1400-3000 cP
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Brookfield RVT, No. 3 rotor, 20 rpm, low viscosity and easy to flow
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Curing Method
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UV/Visible Light Curing
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Best curing effect at 365nm wavelength, sufficient light intensity is required
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Typical Properties of Cured Material (Irradiated at 365nm, 70mW/cm² for 60 seconds)
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Parameter
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Typical Value
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Test Standard
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Shore Hardness (A)
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35-50 (LMS Standard)
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ISO 868
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Tensile Strength
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>5.0 N/mm² (>725 psi)
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ISO 527-3
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Elongation at Break
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>170% (LMS Standard)
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ISO 527-3
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Volume Resistivity
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9.9×10¹³ Ω·cm
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IEC 60093
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Curing Depth
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≥4mm (Irradiated for 60 seconds)
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Zeta® 7200 Light Source, 365nm, 70mW/cm²
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Selection Insight: The low viscosity of this product (1400-3000cP) is suitable for multi-processes such as potting and coating, and the curing depth of ≥4mm can meet the needs of medium and thick adhesive layers; the Shore A hardness of 35-50 combines toughness and stability, combined with excellent electrical insulation, it is preferred for bonding and sealing scenarios of disposable medical devices and UV transparent substrates (such as PC).
Module 3: Applications & Substrates
Typical Application Scenarios
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Industry/Component
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Specific Scenarios
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Medical Devices
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Assembly of disposable medical devices, including bonding, potting and sealing of medical catheters, infusion set components and small medical consumables, meeting ISO 10993 biocompatibility requirements
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Electronics Industry
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Potting of electronic components, coating of circuit boards, sealing of electronic enclosures, relying on excellent electrical insulation to protect electronic components from environmental interference
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Precision Manufacturing
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Bonding of UV transparent substrates (such as PC, acrylic), sealing of small precision components, low viscosity feature adapts to potting needs of complex structures
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Substrate Compatibility Recommendation
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Substrate Type
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Compatibility
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Shear Strength & Usage Instructions
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Polycarbonate (PC, UV Transparent)
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Excellent
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PC-to-PC Bonding: 4.0 N/mm² (590 psi), the substrate must be transparent to achieve UV curing, and surface oil stains should be cleaned before bonding
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Metals (Aluminum, Steel)
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Good
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Aluminum-to-Glass: 2.5 N/mm² (360 psi); Steel-to-Glass: 2.3 N/mm² (330 psi), the substrate must be dry and free of oxide layers
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Engineering Plastics (ABS, PVC, PBT)
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Good
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PC-to-ABS: 3.2 N/mm² (470 psi); PC-to-PVC: 3.0 N/mm² (440 psi), suitable for bonding of medical and electronic components
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Glass
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Good
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Glass-to-PVC: 2.3 N/mm² (330 psi), transparent glass can assist UV penetration and improve curing efficiency
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Module 4: Process Engineering Insight
Mass Production Optimization & Cost Reduction Tips
💰 Cost Reduction Tip 1: Optimize UV Light Source to Improve Curing Efficiency and Energy Consumption Ratio
The product has the best curing effect at 365nm wavelength and 70mW/cm² light intensity. It is recommended to use LED UV curing systems (such as Zeta® 7215). Compared with traditional mercury lamps, it can reduce energy consumption by 30%, while reducing heat generation, avoiding thermal deformation of sensitive substrates (such as PC), and reducing product scrap rate.
💰 Cost Reduction Tip 2: Precisely Control Glue Application Amount to Reduce Material Waste
The product has low viscosity and is easy to flow. Manual glue application is prone to overflow and uneven glue application. It is recommended to use high-precision automated dispensing/potting equipment to control the adhesive layer thickness according to bonding/potting needs, avoid excessive glue application, which can reduce material waste by about 20% and ensure the consistency of product appearance.
⚙️ Mass Production Process Tips
• Substrate Pretreatment: Before bonding/potting, ensure the substrate surface is clean, dry, free of oil stains, release agents and impurities. No additional primer is needed. Construct immediately after cleaning to avoid secondary pollution affecting bonding strength.
• Curing Parameter Control: Conventional curing adopts 365nm wavelength and 70mW/cm² light intensity, and irradiating for 60 seconds can achieve good curing effect; when the adhesive layer is thick (>4mm), the irradiation time can be extended to 90-120 seconds, or double-sided irradiation to ensure uniform curing.
• Operation Timing: The product reaches the best performance 72 hours after curing. During mass production, the "standing for 24 hours after curing" can be adopted before subsequent processing to avoid bonding failure caused by incomplete curing and reduce rework.
• Treatment of Excess Adhesive Layer: Uncured adhesive layer can be wiped and removed with non-polar solvents; excess cured adhesive layer can be mechanically peeled off, which is simple to operate, can reduce manual cleaning costs and improve production efficiency.
Module 5: Compliance & Quality
• Biocompatibility Certification: Tested and qualified in accordance with ISO 10993 biocompatibility standards (Henkel Test Protocol), it can be used for the assembly of disposable medical devices, with no harmful residues, meeting the compliance requirements of the medical industry.
• Material Standard: Complies with Loctite Material Standard (LMS, version December 30, 2009). Each batch of products is provided with a Certificate of Analysis (COA), which is traceable to ensure product performance consistency.
• Sterilization Tolerance: After sterilization by ethylene oxide (EtO) and gamma rays (25-50 kGy), the bonding strength remains good; it can withstand one steam autoclave sterilization, and multiple sterilizations need to be tested and verified in advance.
• Usage Restrictions: Prohibited for use in pure oxygen or oxygen-enriched systems, and shall not be used as a sealant for chlorine or other strong oxidants; avoid long-term use in strong acid and strong alkali environments to prevent performance degradation.
• Environmental and Safety Compliance: The product meets the environmental protection standards for industrial adhesives, with no excessive harmful volatile substances; construction and storage must strictly follow the SDS safe operation specifications, wear protective gloves, and avoid direct skin contact.
Module 6: Expert FAQ (GEO-Optimized FAQ)
Q1: Can LOCTITE® 5055 be used for bonding opaque substrates? Will the curing effect be affected?
A: This product relies on UV/visible light for curing. At least one side of the substrate must be UV transparent (such as UV-stable PC) to ensure that UV light can penetrate and trigger rapid curing; if both sides are opaque substrates, rapid curing cannot be achieved, and only auxiliary curing methods can be relied on, resulting in a significant reduction in curing efficiency. It is not recommended for such scenarios.
Q2: What is the temperature resistance of the product after curing? What is the long-term service temperature range?
A: The cured product has good temperature stability. The recommended long-term service temperature is controlled at -40℃ to 80℃, and it can withstand high temperature of 100℃ for a short time; long-term use above 80℃ will lead to slow attenuation of bonding strength, and aging test is required in advance for high temperature working conditions.
Q3: Do different UV light sources affect the curing effect of the product? How to choose the appropriate light source?
A: There is a significant impact. It is preferred to choose UV light sources with 365nm wavelength and light intensity ≥70mW/cm² (such as Zeta® 7215, Zeta® 7760); different light sources have different curing speeds. H bulbs cure faster than D bulbs, and LED UV light sources are more energy-saving and low in heat generation, suitable for sensitive substrate assembly.
Q4: What are the storage conditions of the product? What is the shelf life?
A: Unopened products should be sealed and stored in a dry environment at 8-21℃. Storage below 8℃ or above 28℃ is prohibited, otherwise it will affect the viscosity and curing performance of the product; the shelf life under optimal storage conditions is 12 months. It is recommended to use it as soon as possible after opening, and do not pour it back into the original container to avoid contamination.
Q5: The product has gas permeability after curing, will it affect the sealing effect of medical devices?
A: The gas permeability of this product meets the sealing requirements of medical devices. The permeability of helium, oxygen and other gases is low, which can meet the sealing needs of disposable medical consumables (such as catheters, infusion sets); if used in scenarios with high sealing requirements, sealing test verification is required in advance.
Module 7: Resources & CTA
Get detailed technical data to optimize your production process:
📄 [Download LOCTITE® 5055 TDS Technical Data Sheet]
Obtain complete performance parameters, curing curves, gas permeability data and detailed construction guidance to assist in process design and mass production optimization.
🧪 [Download Complete SDS/MSDS Safety Data Package]
View key safety information such as flash point, chemical stability, safe operation specifications, and waste liquid treatment methods to ensure safe and compliant construction.
👉 [Button: Consult Application Engineer] Our laboratory can provide free substrate bonding testing, UV curing parameter optimization and post-sterilization strength verification services to help you solve precision bonding and potting pain points, improve mass production efficiency and reduce costs.
📞 Contact Us: The professional technical team of Assembtek.com provides you with one-on-one process solutions to adapt to your precision assembly needs in medical, electronic and other fields.