TWS Acoustic Precision Bonding Beyond Dispensing · Defining Reliability

From IPX7 nano-sealing to drop shock resistance, we deliver turnkey chemistry and process solutions for every true wireless earbud.
How Adhesives Affect Product Quality and Yield?

Core Pain Points of TWS Earbud Manufacturing

Unreliable Structural Bonding
🔊Daily wearing and dropping of earbuds cause shell cracking and component falling off. Traditional adhesives have insufficient bonding strength, leading to yield loss of more than 15%.
Substandard Waterproof Sealing
🧪TWS earbuds need to withstand humid environments such as sweat and rain. Ordinary adhesives are prone to gap leakage, causing motherboard short circuits and battery failure, with a high repair rate.
Pain Points Section
Poor Shock Absorption and Heat Dissipation
 💥High-power operation of earbud chips generates a lot of heat. Without effective shock absorption and thermal management adhesives, sound quality distortion and battery bulging occur, shortening product life.
Difficulty with Multi-Material Compatibility
⚙️TWS earbuds include various materials such as plastic, metal, ceramic, and FPC. Traditional adhesives are difficult to adapt to bonding different materials, leading to debonding, material corrosion, and high adaptation costs.
🎵Sealing & Waterproof Adhesive

Housing & ANC Sealing

Solves micro gaps between plastic and metal. The 3000 cps thixotropic adhesive perfectly fills 0.05 mm gaps. UV-moisture dual curing ensures waterproof and sweatproof performance.
Housings of TWS Earphones
Charging Case Shell Assembly
🎚️Component Protection Adhesive

FPC Reinforcement & Mainboard Bonding

Reinforced bonding between flexible circuit boards and mainboards, capable of withstanding repeated bending and impact. UV-cured epoxy is adopted, with setting in 3 seconds and internal stress lower than 5 MPa.
FPC solder joint protection
Speaker fixing
Battery encapsulation
🔋Component Protection Adhesive

Battery Tab Fixing & Encapsulation

Fast-curing UV adhesive delivers excellent bonding to PC and metal. It withstands 260°C reflow soldering for 3 seconds without peeling, while protecting solder joints.
Sealing gaps in earphone charging cases
Main body & ear tips
Battery compartments
⚙️ More points: magnetic circuit fixation, FPC grounding, microphone sealing...

From Formulation to Mass Production — Seamlessly Realize Your TWS Assembly

Showcase what makes your brand unique and valuable.
✓ Design Phase · Joint Evaluation
✓ Material Selection · Chemical Pairing
✓ Dispensing Process · Jetting/Needle