Henkel expands its award-winning portfolio of Technomelt low-pressure molding materials by launching the brand-newTechnomelt PA 6370. Formulated with a polyamide-based hot melt system, this material features high fluidity and ultra-low melt viscosity, specially developed for intricate, high-complexity electronic systems and components. It is capable of filling micro gaps as narrow as 0.5mm. The formulation satisfies stringent industrial standards with excellent moisture, heat and corrosion resistance, greatly enhancing overall operational reliability of electronic assemblies.
Innovative Low-pressure Molding Hot Melt
Compared with conventional potting and encapsulation materials, Technomelt series features rapid processing, mild molding conditions and lower carbon emissions. Traditional potting requires up to eight processing steps and a curing time of 24 hours. In contrast, Technomelt hot melt completes electronic encapsulation with merely three simple steps under low pressure, and the cycle time can be shortened to 30 seconds. Historically, balancing precise micro-gap filling and inherent protective performance has remained a bottleneck for manufacturers, an issue fully resolved by Technomelt PA 6370.
The product presents ultra-low melt viscosity (2700–3000 mPa·s @ 210°C; 1065–1180 mPa·s @ 240°C), delivering superior penetration capability and substrate wettability, as well as stable adhesion performance across diverse substrates. It has passed rigorous high-temperature and high-humidity aging tests, maintaining stable lap shear strength after 1,200 hours of exposure to an extreme environment (85°C/85% RH).
Justin Kolbe, Senior Business Development Manager at Henkel, stated: “Achieving void-free small-gap filling and sustainable adhesion strength after exposure to water, salt spray, humidity and thermal aging has long been a critical industry challenge. This makes Technomelt PA 6370 a groundbreaking solution for electronic protection. For electronic assemblies with tiny gaps serving harsh outdoor environments, this material provides outstanding manufacturing flexibility, high production throughput, certified UL flame retardancy and premium environmental durability.”
Market Value｜Breakthrough for Electronic Packaging
Technomelt PA 6370 possesses outstanding electrical insulation properties and complies with UL 94 V-0 flame retardancy standards. Its low coefficient of thermal expansion (CTE) of 175 ppm outperforms or matches most commercial two-part polyurethane and epoxy potting materials. Such advantages enable consistent dimensional stability and effective stress deformation resistance within a wide operating temperature range from -20°C to 140°C.
According to Kolbe, this innovative material greatly enriches manufacturers’ electronic protection solutions. “This innovation eliminates traditional performance trade-offs,” he concluded. “Manufacturers can obtain fast production speed, superior intricate part penetration and reliable high-level device protection simultaneously. Technomelt PA 6370 bridges the existing market gap.”
Technomelt PA 6370 is ideal for diverse low-voltage applications, including motors, connectors, sensors and printed circuit boards, as well as all electronic devices deployed in severe working conditions. Click here to learn detailed information about Technomelt PA 6370 or request product samples.
