May 28, 2026 – Dow (NYSE: DOW) announced the launch of DOWSIL™ TC-3120 Thermal Gel, a silicone-based material designed to optimise heat transfer and provide optical-grade cleanliness. It offers the highest thermal conductivity (~12 W/m·K) among Dow’s commercially available silicones and is formulated to reduce oil bleed and condensate outgassing – contaminants that can degrade the reliability of optical components and electronic devices.
The exceptional thermal conductivity of DOWSIL™ TC-3120 Thermal Gel makes it suitable for 800G and 1.6T optical modules, high-density electronic components, and high-speed data applications that generate significant amounts of heat. Applications include optical transceivers, telecommunications, electronic module assembly, autonomous vehicles, and automotive electronic controllers.
The optical cleanliness of this new material helps reduce the risk of contamination of photodiodes, optical fibres, and lenses. DOWSIL™ TC-3120 Thermal Gel is supplied as a flowable liquid and can be compressed to a minimum bond line thickness of 200 μm to achieve effective heat transfer. This one-component, reworkable material fills large gaps and can be heat-accelerated for curing.
Although DOWSIL™ TC-3120 Thermal Gel contains a high loading of thermally conductive fillers, this ultra-high-kappa (ultra-high-K) material is easily dispensable and supports a controlled extrusion rate – a rare combination for ultra-high-K materials that also require high dielectric constant and ultra-high thermal conductivity.
Many such materials also release silicone oil and can be difficult to maintain a stable bond line thickness during production. The reduced oil bleed of DOWSIL™ TC-3120 Thermal Gel helps minimise contamination of sensitive components, adhesion interference, and optical failures.
“DOWSIL™ TC-3120 Thermal Gel maximises heat transfer without sacrificing reliability, especially for optical and high-speed data applications,” said Cathy Chu, Global Strategic Marketing Director, Consumer & Electronics, Dow. “And it is highly efficient to process.”
Among its benefits, DOWSIL™ TC-3120 Thermal Gel is designed to withstand high temperature and humidity, shock and vibration, and repeated thermal cycling. It forms a stable interface, resists cracking, and stays in place under mechanical stress. In addition, it exhibits no slump in vertical modules such as optical transceivers. This new material is recommended for the interface between modules and heat sinks, and for applications with tolerance stack-ups or uneven surfaces.
DOWSIL™ TC-3120 Thermal Gel is the latest addition to Dow’s Cooling Science portfolio – a system-level thermal management approach that combines materials with testing and engineering expertise to help customers design cooler, more reliable, and more efficient electronic systems.
DOWSIL™ TC-3120 Thermal Gel is available globally.
In data centre servers, DOWSIL™ TC-3120 Thermal Gel can be used in optical modules, dense electronic components, and high-speed data applications.
About Dow
Dow (NYSE: DOW) is one of the world’s leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility, and consumer applications. Its global reach, asset integration and scale, customer-centric innovation, and leading business positions enable profitable growth and help deliver a sustainable future. Dow operates manufacturing sites in 29 countries and employs approximately 34,600 people. The company delivered sales of approximately $40 billion in 2025. References to “Dow” or “the Company” mean Dow Inc. and its subsidiaries.
